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Xilence XZ018 / ZUB-XPTP heat sink compound Thermal paste 5.15 W/m·K 1.5 g by Xilence


Xilence XZ018 / ZUB-XPTP heat sink compound Thermal paste 5.15 W/m·K 1.5 g Image

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Key Features

  • Thermal paste 5.15 W/m·K
  • 0.201 °C/W
  • Black, White
  • 1 pc(s)
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Details
The Xilence Thermal Paste has a high thermal conductivity guarantees an efficient heat exchange and low temperatures. The paste works reliably at temperatures from -30 to +280°C
Specifications
WEIGHT / VOLUME 1.5 g
THERMAL CONDUCTIVITY 5.15 W/m·K
OPERATING TEMPERATURE -30 - 280 °C
COLOR Black, White
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