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Team Group XTREEM FFXD532G7600HC36FDC01 memory module 32 GB 2 x 16 GB DDR5 7600 MHz ECC by Team


Team Group XTREEM FFXD532G7600HC36FDC01 memory module 32 GB 2 x 16 GB DDR5 7600 MHz ECC Image

1 IN STOCK  (0 local - 1 remote) 
€197.86 (incl. VAT)
Expected to ship within 7 days of order
Free shipping within Ireland!

Key Features

  • Honorable T-FORCE Logo exceeds overclocking limits
  • Meticulously layered high-quality aluminum sandblasted fin for exceptional heat dissipation
  • Sturdy 2mm heat spreader for perfect heat dissipation improvement
  • High-quality IC with the patented technique
  • Power management chip for stable and effective power usage
  • On-Die ECC for a more stable system
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Honorable T-FORCE Logo exceeds overclocking limits
With T-FORCE LAB’s superb R&D capability, the brand-new T-FORCE XTREEM DDR5 exceeds the frequency limit of DDR5 memory. The product has T-FORCE logo symbolizing our utmost pride, showcasing its exceptional existence, it is definitely the best choice in the world of overclocking products.

Meticulously layered high-quality aluminum sandblasted fins for exceptional heat dissipation
Inspired by the image of energy conversion between the hot and cold under high temperatures from a volcano, the exterior and looks of T-FORCE XTREEM DDR5 has meticulously layered high-quality aluminum sandblasted fins resembling the texture of basalt and the beach, delivering exceptional heat dissipation capabilities. The surface is etched with T-FORCE logo to certify its excellence.

Sturdy 2mm heat sink for perfect heat dissipation improvement
T-FORCE XTREEM DDR5 adopts 2mm aluminum alloy heat spreader to increase its quality and heat capacity. The product also has thermal gap pad with high thermal conductivity to strengthen PMIC heat dissipation effects, coupled with anti-acid, alkaline, rust and inconducive anodic treatment on the surface to deliver perfect heat dissipation performance overall.

High-quality IC with patented technique
Uses our proprietary IC grading testing validation technique—GRADING METHOD FOR MEMORY (Invention patent number in Taiwan: I751093; Invention patent number in USA: US11488679B1) to develop DDR5 high-performance memory module successfully.

Power management chip for stable and effective power usage
Power management chip minimizes noise interference, stabilizes power and distributes power to each electronic component effectively, supplying power to the system with stability and fastness.

On-Die ECC for a more stable system
Supported with On-die ECC providing error correction and detection, the mechanism stabilizes the system while pursing performance.
Specifications
CAPACITY 32 GB
SPEED 7600 MHz
SINGLE / DUAL / QUAD KIT Dual channel kit
CAS LATENCY 36
VOLTAGE 1.4 V
HEATSINK COLOR Heatsink
TECHNOLOGY 288-pin DIMM
MEMORY LAYOUT 2 x 16 GB
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